NTE435K52 Details_NTE435K52 PDF Document_NTE Electronics, Inc-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Bulk
Type	DIP, 0.698" (17.72mm) Row Spacing
Number of Positions or Pins (Grid)	52 (2 x 26)
Pitch - Mating	-
Contact Finish - Mating	-
Contact Finish Thickness - Mating	-
Contact Material - Mating	-
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	0.070" (1.78mm)
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	-
Housing Material	-
Operating Temperature	-

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