26-822-90C Details_26-822-90C PDF Document_Aries Electronics-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	Vertisockets™ 800
Package	Bulk
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	26 (2 x 13)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole, Right Angle, Horizontal
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-55°C ~ 105°C

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