9-1437539-1 Details_9-1437539-1 PDF Document_TE Connectivity AMP Connectors-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	800
Package	Box
Type	DIP, 0.1" (2.54mm) Row Spacing
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	25.0µin (0.63µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	-
Housing Material	Polyester
Operating Temperature	-55°C ~ 105°C

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