808-AG11D-ES-LF Details_808-AG11D-ES-LF PDF Document_TE Connectivity AMP Connectors-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	800
Package	Tube
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	8 (2 x 4)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	20.0µin (0.51µm)
Contact Material - Post	Copper
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature	-55°C ~ 105°C

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