3-1674770-2 Details_3-1674770-2 PDF Document_TE Connectivity AMP Connectors-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Tape & Reel (TR)
Type	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	478 (26 x 26)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Surface Mount
Features	Open Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30.0µin (0.76µm)
Contact Material - Post	Copper Alloy
Housing Material	Thermoplastic
Operating Temperature	-

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