714-43-242-31-018000 Details_714-43-242-31-018000 PDF Document_Mill-Max Manufacturing Corp.-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	714
Package	Bulk
Type	DIP, 0.1" (2.54mm) Row Spacing
Number of Positions or Pins (Grid)	42 (2 x 21)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Carrier, Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30.0µin (0.76µm)
Contact Material - Post	Brass Alloy
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature	-55°C ~ 125°C

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