21-0517-90C Details_21-0517-90C PDF Document_Aries Electronics-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	0517
Package	Bulk
Type	SIP
Number of Positions or Pins (Grid)	21 (1 x 21)
Pitch - Mating	-
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole, Right Angle
Features	-
Termination	Solder
Pitch - Post	-
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-

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