SIP050-1X30-157BLF Details_SIP050-1X30-157BLF PDF Document

Sockets for ICs Transistors

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Specifications

Description	Details
Series	SIP050-1x
Package	Bulk
Type	SIP
Number of Positions or Pins (Grid)	30 (1 x 30)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	200.0µin (5.08µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Brass
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature	-

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