XR2T2401N Details_XR2T2401N PDF Document_Omron Electronics Inc-EMC Div-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	XR2
Package	Bulk
Type	DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid)	24 (2 x 12)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	29.5µin (0.75µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Threaded
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	29.5µin (0.75µm)
Contact Material - Post	Brass
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55°C ~ 125°C

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