SPF080-1X08-998Z Details_SPF080-1X08-998Z PDF Document

Sockets for ICs Transistors

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Specifications

Description	Details
Series	SPF080-1x
Package	-
Type	SIP
Number of Positions or Pins (Grid)	8 (1 x 8)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin-Lead
Contact Finish Thickness - Mating	200.0µin (5.08µm)
Contact Material - Mating	-
Mounting Type	Through Hole
Features	Closed Frame
Termination	-
Pitch - Post	-
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	-
Housing Material	-
Operating Temperature	-

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