528-AG11D-ESL Details_528-AG11D-ESL PDF Document_TE Connectivity AMP Connectors-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	500
Package	Bulk
Type	DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	5.00µin (0.127µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	5.00µin (0.127µm)
Contact Material - Post	Brass, Copper
Housing Material	Polyester
Operating Temperature	-55°C ~ 125°C

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