1825088-2 Details_1825088-2 PDF Document_TE Connectivity AMP Connectors-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Bulk
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	12 (2 x 6)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole, Right Angle, Horizontal
Features	Closed Frame
Termination	Press-Fit
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	Brass
Housing Material	Thermoplastic, Polyester
Operating Temperature	-

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