NTE435P18 Details_NTE435P18 PDF Document_NTE Electronics, Inc-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Bag
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	18 (2 x 9)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	-
Contact Finish Thickness - Mating	-
Contact Material - Mating	-
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	-
Housing Material	-
Operating Temperature	-

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