1-1571995-0 Details_1-1571995-0 PDF Document_TE Connectivity AMP Connectors-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	510
Package	Bulk
Type	SIP
Number of Positions or Pins (Grid)	10 (2 x 5)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	20.0µin (0.51µm)
Contact Material - Post	Copper
Housing Material	Thermoplastic, Polyester
Operating Temperature	-

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