268-5401-50-1102JH Details_268-5401-50-1102JH PDF Document

Sockets for ICs Transistors

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Specifications

Description	Details
Series	OEM
Package	Bulk
Type	CLCC
Number of Positions or Pins (Grid)	68 (4 x 17)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30.0µin (0.76µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	-55°C ~ 105°C

Other

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