TMJ03DKSD-S1512 Details_TMJ03DKSD-S1512 PDF Document_Sullins Connector Solutions-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Tray
Type	Transistor, TO-254
Number of Positions or Pins (Grid)	3 (Rectangular)
Pitch - Mating	0.150" (3.81mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Flange
Termination	Solder
Pitch - Post	0.150" (3.81mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30.0µin (0.76µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS)
Operating Temperature	-50°C ~ 175°C

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