EB176-A-02-V-RA-TSMT Details_EB176-A-02-V-RA-TSMT PDF Document

Wire to Board

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Specifications

Description	Details
Series	EB
Package	Tray
Number of Levels	1
Positions Per Level	2
Pitch	0.098" (2.50mm)
Mating Orientation	Horizontal with Board
Current	6 A
Voltage	150 V
Wire Gauge	20-24 AWG
Mounting Type	Surface Mount
Wire Termination	Screwless - Leg Spring, Push-In Spring
Features	Solder Retention
Color	Black

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