BDN14-3CB/A01 Details_BDN14-3CB/A01 PDF Document_CTS Thermal Management Products-Galaxy Core City

Thermal - Heat Sinks

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Specifications

Description	Details
Series	BDN
Package	Box
Type	Top Mount
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Thermal Tape, Adhesive (Included)
Shape	Square, Pin Fins
Length	1.410" (35.81mm)
Width	1.410" (35.81mm)
Diameter	-
Fin Height	0.355" (9.02mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	5.60°C/W @ 400 LFM
Thermal Resistance @ Natural	16.20°C/W
Material	Aluminum
Material Finish	Black Anodized

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