A16366-13 Details_A16366-13 PDF Document_Laird Technologies

Thermal - Pads

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Specifications

Description	Details
Series	Tflex™ SF600
Package	Bulk
Usage	-
Type	Gap Filler Pad, Sheet
Shape	Square
Outline	457.20mm x 457.20mm
Thickness	0.130" (3.30mm)
Material	Non-Silicone, Boron Nitride Filled
Adhesive	-
Backing, Carrier	-
Color	Pink
Thermal Resistivity	-
Thermal Conductivity	3.0W/m-K

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