R7F701408EABG-C#BC1 Details_R7F701408EABG-C#BC1 PDF Document_Renesas Electronics America Inc-Galaxy Core City

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Specifications

Description	Details
Series	RH850/D1x
Package	Tray
Core Processor	RH850G3M
Core Size	32-Bit
Speed	240MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals	DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O	159
Program Memory Size	3.75MB (3.75M x 8)
Program Memory Type	FLASH
EEPROM Size	64K x 8
RAM Size	512K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V
Data Converters	A/D 20x8b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 150°C (TJ)
Mounting Type	Surface Mount
Package / Case	376-BGA
Supplier Device Package	376-BGA (23x23)

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