ATSAM3S1AA-MUR Details_ATSAM3S1AA-MUR PDF Document_Microchip Technology-Galaxy Core City

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Specifications

Description	Details
Series	SAM3S
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	ARM® Cortex®-M3
Core Size	32-Bit
Speed	64MHz
Connectivity	I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	34
Program Memory Size	64KB (64K x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	16K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V
Data Converters	A/D 8x10/12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	48-VFQFN Exposed Pad
Supplier Device Package	48-QFN (7x7)

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