UPD70F3529GMA9-GBK-Q-G Details_UPD70F3529GMA9-GBK-Q-G PDF Document_Renesas Electronics America Inc-Galaxy Core City

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Specifications

Description	Details
Series	V850E2/Dx4-H
Package	Tray
Core Processor	V850E2M
Core Size	32-Bit
Speed	80MHz
Connectivity	CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals	DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O	127
Program Memory Size	2GB (2G x 8)
Program Memory Type	FLASH
EEPROM Size	32K x 8
RAM Size	96K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V
Data Converters	A/D 12x10b, 12x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount
Package / Case	176-LQFP Exposed Pad
Supplier Device Package	176-HLQFP (24x24)

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