R7F7016904AFP-C#BA1 Details_R7F7016904AFP-C#BA1 PDF Document_Renesas Electronics America Inc-Galaxy Core City

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Specifications

Description	Details
Series	RH850/F1x
Package	Tray
Core Processor	RH850G3KH
Core Size	32-Bit
Speed	120MHz
Connectivity	CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals	DMA, PWM, WDT
Number of I/O	49
Program Memory Size	1MB (1M x 8)
Program Memory Type	FLASH
EEPROM Size	64K x 8
RAM Size	128K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V
Data Converters	A/D 10x10b, 11x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 125°C (TA)
Mounting Type	Surface Mount
Package / Case	64-QFP
Supplier Device Package	64-LFQFP

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