TMPM4G9F10FG(DBB) Details_TMPM4G9F10FG(DBB) PDF Document_Toshiba Semiconductor and Storage-Galaxy Core City

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Specifications

Description	Details
Series	-
Package	Tray
Core Processor	ARM® Cortex®-M4F
Core Size	32-Bit
Speed	160MHz
Connectivity	CEC, EBI/EMI, I²C, IrDA, SIO, SPI, SMIF, UART/USART
Peripherals	DMA, LVD, POR, WDT
Number of I/O	150
Program Memory Size	1MB (1M x 8)
Program Memory Type	FLASH
EEPROM Size	32K x 8
RAM Size	192K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 3.6V
Data Converters	A/D 24x12b; D/A 2x8b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 70°C (TA)
Mounting Type	Surface Mount
Package / Case	100-LQFP
Supplier Device Package	100-LQFP (14x14)

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