UPD70F3557AM1GMA1-GBK-AX Details_UPD70F3557AM1GMA1-GBK-AX PDF Document_Renesas Electronics America Inc-Galaxy Core City

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Specifications

Description	Details
Series	V850E2/Fx4
Package	Tray
Core Processor	V850E2
Core Size	32-Bit
Speed	80MHz
Connectivity	CANbus, CSI, I²C, LINbus, UART/USART
Peripherals	DMA, PWM, WDT
Number of I/O	136
Program Memory Size	1.5MB (1.5M x 8)
Program Memory Type	FLASH
EEPROM Size	64K x 8
RAM Size	112K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V
Data Converters	A/D 40x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 110°C (TA)
Mounting Type	Surface Mount
Package / Case	176-LQFP Exposed Pad
Supplier Device Package	176-HLQFP (24x24)

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