A2F200M3F-FGG256 Details_A2F200M3F-FGG256 PDF Document_Microchip Technology-Galaxy Core City

System On Chip (SoC)

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Specifications

Description	Details
Series	SmartFusion®
Package	Tray
Architecture	MCU, FPGA
Core Processor	ARM® Cortex®-M3
Flash Size	256KB
RAM Size	64KB
Peripherals	DMA, POR, WDT
Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed	80MHz
Primary Attributes	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature	0°C ~ 85°C (TJ)
Package / Case	256-LBGA
Supplier Device Package	256-FPBGA (17x17)

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