XC7Z035-3FBG676E Details_XC7Z035-3FBG676E PDF Document

System On Chip (SoC)

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Specifications

Description	Details
Series	Zynq®-7000
Package	Tray
Architecture	MCU, FPGA
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size	-
RAM Size	256KB
Peripherals	DMA
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	800MHz
Primary Attributes	Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature	0°C ~ 100°C (TJ)
Package / Case	676-BBGA, FCBGA
Supplier Device Package	676-FCBGA (27x27)

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