BGA0033 Details_BGA0033 PDF Document_Chip Quik Inc.-Galaxy Core City

Adapter、 Breakout Boards

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Specifications

Description	Details
Series	Proto-Advantage
Package	Bulk
Proto Board Type	SMD to Plated Through Hole Board
Package Accepted	BGA
Number of Positions	144
Pitch	0.020"" (0.50mm)
Board Thickness	0.063"" (1.60mm)
Material	FR4 Epoxy Glass
Size / Dimension	2.100"" L x 2.000"" W (53.34mm x 50.80mm)

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