TS391LT250 Details_TS391LT250 PDF Document_Chip Quik Inc.-Galaxy Core City

Solder

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Solder Paste
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter	-
Melting Point	281°F (138°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Lead Free
Form	Jar, 8.8 oz (250g)
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	68°F ~ 77°F (20°C ~ 25°C)

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