DILB32P-223TLF Details_DILB32P-223TLF PDF Document_Amphenol ICC (FCI)-Galaxy Core City

Sockets for ICs Transistors

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Specifications

Description	Details
Series	DILB
Package	Tube
Type	DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)	32 (2 x 16)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin-Lead
Contact Finish Thickness - Mating	100.0µin (2.54µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	100.0µin (2.54µm)
Contact Material - Post	Copper Alloy
Housing Material	Polyamide (PA), Nylon
Operating Temperature	-55°C ~ 125°C

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